Amkor Technology Inc (AMKR) Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Amkor Technology Inc (AMKR)

AMKR 49.04

+2.2%

3:59 PM EST

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: tech101 who wrote (337)	8/13/1999 9:31:00 PM
From: tech101	Read Replies (1) of 1056

Packaging for Optical Devices Product Development Announcement: VisionPak™ Package : An optical device package, Amkor's VisionPak™ offers a cost effective packaging solution for image sensor devices using an optical quality window. A ceramic substrate is dispensed with an epoxy dam which supports the optical grade glass lid. VisionPak™ is offered in Ball Grid Array or LCC style footprints, and provides a large degree of design flexibility. The package uses standard assembly technology with an enhanced clean room at front of line to minimize particulate contamination of the image sensor. VisionPak™ is assembled in array format and singulated into individual units at end of line. Array assembly allows package size flexibility without having to customize assembly equipment. SMT assembly processes and techniques are compatible with VisionPak™. The LCC variant allows image sensor footprint drop-in compatibility, while the Ball Grid Array variant enables cost minimization though size reduction. In its Ball Grid Array form or through custom LCC footprints, VisionPak™ provides a scalable packaging cost with die size, a highly desirable feature for the imager market. Applications: The VisionPak™ is designed to provide a flexible packaging solution for the optical device marketplace. The package is specifically developed for optical products such as image array sensors, scanner and display devices. Features: Innovative features allow flexible design strategies to meet customer requirements, using an established process. • Array assembly enabling low cost custom design minimizing production tooling requirements. • Optical device clean assembly area, class 100. • Customer / Application specific design solution, with full in-house design capability Reliability: This package has typically passed JEDEC Level 3 (30/60%RH, 192 hrs, 3XIR@240) for Amkor's internal Select Qual B. Based on internal modeling results, solder joint reliability is anticipated to be >450 cycles for -40 to 125 degrees C.

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next