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Politics : Formerly About Applied Materials

AMAT 225.18

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Nov 18 3:59 PM EST

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To: Gottfried who wrote (32337)	8/30/1999 3:33:00 AM
From: Duker	Read Replies (2) of 70976

TI taps M+W to complete initial 300-mm fab cleanroom semibiznews.com A service of Semiconductor Business News, CMP Media Inc. Story posted 2:45 p.m. EST/11:45 a.m., PST, 8/27/99 DALLAS -- Germany's M+W Zander Facility Engineering GmbH today announced it has won a $50 million contract from Texas Instruments Inc. to design and construct a cleanroom inside TI's DMOS-6 wafer fab here. Built more than a year ago, the DMOS-6 facility is scheduled to become TI's first 300-mm wafer fab with the initial phase of cleanroom setup to be completed in the first half of 2000, according to M+W Zander. TI, like other chip makers, opted to postpone its move to larger 300-mm wafers while the industry worked it way through a fab-capacity glut last year. M+W Zander designed the DMOS-6 facility and will now complete the work on the building's initial cleanroom through its Meissner+Wurst U.S. operations. The project is the sixth wafer fab that M+W Zander has built for TI, according to the Stuttgart-based company. Last year, TI announced it would use the DMOS-6 facility to produce 0.13-micron [drawn feature size] ICs with a copper interconnect option using 300-mm wafers. A spokeswoman for TI in Dallas today said the company was now entering the cleanroom design-and-construction phase of the DMOS-6 fab. She said installation of 300-mm equipment will probably occur by the end of next year with volume production of digital signal processors (DSPs) and analog ICs beginning in the second half of 2001. --J. Robert Lineback

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