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Politics : Formerly About Advanced Micro Devices

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To: Paul Engel who wrote (70702)9/2/1999 3:04:00 AM
From: Process Boy  Read Replies (1) of 1574090
 
Paul - <TWY - Re: " The PPCs Motorola delivered to Apple for their G4s appear to be from a .25um technology and NOT .18um as they previously
advertized. It's a 1.8V process (10.5 million devices) at 83mm2. The G3 predecessor from IBM was 40mm2 (6.5 million devices) in .25um technology. Adding AtliVec instructions approximatalLy doubled the size of the chip. So this is not a .18um process.(at least not in the BEOL) If not, then AMD will be scheduled to produce .18um Cu BEOL processors before their mentor Motorola does it."
NOT according to THIS article:

"Motorola said the chip is being fabricated with a new 0.18-micron (0.15-micron L-effective) copper HiPerMOS process. All six levels of metal use copper instead of traditional aluminum interconnects. ">

I believe what WY is suggesting the the Front End of the process is .18", but the G4 die size vs. circuit density doesn't match up for a true .18 back end. I.e., maybe MOT's Cu process is not ready for .18 design rules.

I don't know, but I find that an interesting set of circumstances if true.

I believe AMD's front end Athlon process may well be a .18 type process, but of course it would still have .25 interconnects.

If MOT is behind in delivering their own .18 Cu, then I wonder how Dresden is doing?

Again, this is a lot of ifs, and I'm only speculating out loud.

I wish I knew more about the Gx processors to try and validate WY's postulations, but I don't.

PB
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