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Jul 10 5:00 PM EST

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To: Ram Seetharaman who wrote (5978)	9/16/1999 1:19:00 AM
From: DJBEINO	Read Replies (1) of 9582

UMC to Make Chips Using 300mm Wafers in 3Q 2001 September 16, 1999 (TOKYO) -- Taiwan's UMC Group told Nikkei Microdevices that it plans to begin production of microchips using 300mm wafers in the third quarter of 2001. The UMC Group will start building a wafer plant in Tainan in November. It hopes to install manufacturing equipment at the plant in the fourth quarter of 2000. The company is now testing the production equipment for the 300mm wafers. "Our foundry business is right in front of a big opportunity," said Frank C. Wen, president of Taiwan's United Silicon Inc. (USIC), an affiliated group company. Japanese microchip makers are proceeding with their production outsourcing and corporate restructuring. The consignment of chip production to foundries has been increasing since the beginning of this year. Wen noted that the group's production lines are working at full capacity. nikkeibp.asiabiztech.com

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