Formerly About Advanced Micro Devices Message Board

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Politics : Formerly About Advanced Micro Devices

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To: Dan3 who wrote (72316)	9/19/1999 8:46:00 PM
From: Yousef	Read Replies (2) of 1572433

Dan3, Re: "He mentions the problem of filling voids - is there any benefit to copper over aluminum in this area?" YES Dan3 ... There are tremendous differences in ILD gap fill between copper damascene and traditional Aluminum processing. In fact, this is one of the major processing advantages of damascene. The reason is that once you have etched a trench, filled with copper, and then polished ... You have a very flat surface on which to deposit the next ILD. Expensive, complicated ILD deposition techniques are not needed in damascene processing. Make It So, Yousef

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