Aehr forms test fixtures unit for known-good die, advanced IC burn-in/testing
Semiconductor Business News (09/20/99, 12:17:04 PM EDT)
MOUNTAIN VIEW, Calif.--Aehr Test Systems here today announced the formation of a new test fixtures business unit to serve burn-in and testing systems for advanced memories and logic ICs, including unpackaged chip products.
The new Aehr Test Fixtures unit will focus on enhancing the company's ability to serve customers with specialized burn-in and test requirements not currently available in existing equipment, said the company. The new unit will handle Aehr's DiePak carriers for known good die testing, which enable chip companies to sell ICs as bare die products. Aehr Test Fixtures will also be responsible for the company's MTX massively parallel testers, burn-in boards as well as the MAX and ATX Dynamic Burn-in systems.
"The new group is designed to offer the responsiveness required to meet the quick turnaround requirements of the fixturing business," said Rhea Posedel, president and CEO of Aehr Test. "We expect this group will help advance sales and improve service in this important segment of our business."
Heading the new business unit is Rick Pendergrass. "We are particularly excited about the increased level of interest in the DiePak known good die product," Pendergrass said. "We believe we are seeing the effects of growing mission-critical requirements among components users inthe aerospace, military, automotive, and medical equipment fields. Current quote and order activity is showing an upward trend in these areas."
While unpackaged semiconductors have been sold into many low-cost consumer product applications, the use of bare die products has been limited in commercial systems because of the difficulty in guaranteeing reliability and the costs of testing (see feature story from SBN Online Magazine). However, new carriers and wafer-level burn-in/testing concepts could help to lower the cost of known-good die, according to KGD proponents. |