September 21, 1999 16:22
Independent Test Data Indicates CL200+ Compares Favorably With Epoxy/PPO Laminates; Expands Premium Priced Market Opportunity
HAUPPAUGE, NY--(BUSINESS WIRE)--Sept. 21, 1999--Compositech Ltd. (NASDAQ: CTEK), which manufactures high Tg laminates for the printed circuit board fabrication industry, announced today that electrical property tests performed by an independent laboratory to determine the dielectric constant (Dk) and dissipation factor (Df) of Compositech's CL200+ laminates resulted in performance approximately equivalent to epoxy/PPO thin core laminates. These laminates are used in a rapidly growing, high-performance segment of the electronics market where a premium is placed on electrical performance.
The tests were performed on .005" dielectric thickness samples by an independent test laboratory on Compositech's CL200+ and competitive premium priced laminates. The tests measured Dk and Df at frequencies of 1 MHz, 1 GHz and 10 GHz utilizing test methods ASTM D 150-95 and ASTM D 2520-95. Over the 1 MHz to 10 GHz range, the Dk for CL200+ averaged 3.37 with a range of .14; while the measurements for Df averaged 0.0118 with a range of 0.0026. Comparative values over the same frequencies for the epoxy / PPO samples were 3.32 for Dk with a range of .26 and 0.0134 for Df with a range of 0.0026.
"This comparative testing corroborates the performance indications we have been receiving from the companies who are currently using or evaluating CL200+. Major OEM's are demanding increased circuit density, greater reliability and improved electrical performance from their printed circuit suppliers. CL200+ in combination with prepregs from a wide variety of suppliers represents a unique enabling technology in meeting these requirements." said Ed Kelley, Technical Director of Compositech. "Furthermore, we are very excited about these results not only because CL200+ presents a unique solution to current demands, but also because the innovative process developed and patented by Compositech enables future advances into new market segments and the capability to meet ever more stringent technology demands in the future."
Compositech's CL200+ is a unique high Tg thin core filament wound laminate with exceptional dimensional stability, superior surface smoothness and consistent structure in all core thicknesses which enables higher production yields for the most demanding printed circuit designs. "The performance of CL200+ thin laminate cores in combination with ultra high performance prepregs such as epoxy / PPO open new market opportunities in higher value added, higher performance and premium priced materials to meet OEM and printed circuit fabricator requirements." said Chris Johnson, president and CEO of Compositech.
About Compositech Ltd.
Compositech Ltd. develops, produces and markets innovative and
superior copper clad and fiberglass epoxy laminates used to
manufacture printed circuit boards which are essential components of
personal computers, workstations, data communications, Internet
servers and telecommunications equipment. The company's Web address is
www.compositechltd.com.
The statements made in this press release contain certain
forward-looking statements within the meaning of Section 27A of the
Securities Act of 1933 and Section 21E of the Securities Act of 1934
that involve a number of risks and uncertainties. Actual events or
results may differ from the Company's expectations. In addition to the
matters described in this press release, risk factors listed from time
to time in the Company's SEC reports and filings, including, but not
limited to, its reports on Form 10-QSB for the quarter ended June 30,
1999, its registration statement on Form S-3 declared effective by the
Securities and Exchange Commission on June 15, 1999 and its report on
Form 10-KSB for the year ended December 31, 1998, may effect the
results achieved by the company.
CONTACT: Compositech Ltd.
Samuel S. Gross, CFO
516/436-5200 extension 112
or
Nancy Miller, Investor Relations
561/470-3646
COMPOSITECH LTD - CTEK
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09/21/99 16:47 PM EDT
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