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Politics : Formerly About Advanced Micro Devices

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To: Tenchusatsu who wrote (73052)	9/25/1999 1:10:00 AM
From: grok	Read Replies (4) of 1575803

RE: "<Samsung lists 256M byte RIMMS as validated, I presume with 16 chips. The max memory situation is the same with either 2 or 3 slots. What am I missing?> You must mean the double-sided RIMMs, where 16 chips are placed on both sides of the module. I've heard about them, but I didn't really try and confirm their existence. Perhaps there isn't very many of those double-sided RIMMs around. And that's quite a shortage, considering the lack of even single-sided RIMMs out there. I'm sure we'll find out more this Monday. Tenchusatsu" If you go here: usa.samsungsemi.com you can see "Validated by Intel" in the comment field for 128MByte RIMM but not for 192 or 256MByte. I believe that double sided RIMMs require Rdrams with "mirror image" package footprint so that match pin-for-pin with the chip on the other side with vias going right through the RIMM. This may delay availability and validation. I had heard somewhere that more than 8 Rdrams on a RIMM doesn't work but I cannot remember where I heard it. But, at least, it looks like they're not validated. So if you have to use 128MByte RIMMs then it looks like you've got either 384MBytes Max mem with 3 slots or 256MByte max mem if the 3rd slot doesn't work. I think that Dell was trying to get 384MB to work and failed. Maybe all this mess got Michael Dell to realize that even if all the problems are solved he can't put more than 512MB on Camino and he blew his stack at his engineers. They immediately pointed their fingers at Intel. Someone finally leaked it to the press. The press got all confused and reported that more then 512MB cannot be used due to 3rd slot no good. Maybe Monday we'll see Intel trying to announce product with 256MB max mem. Then we'll see if any OEMs are willing to ship it.

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