SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Politics : Formerly About Advanced Micro Devices
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Bill Jackson who wrote (73132)9/26/1999 1:18:00 AM
From: Yousef  Read Replies (1) of 1571681
 
Bill,

Re: "Is it traces of copper being carried in water?, or mechanical deposition of
a few cooper atoms in a depositon stage?"

One of the key steps is the cleaning of wafers after Copper polishing. To polish
Copper, a slurry and pad are used to chemically/mechanically "grind"
the Copper off the wafers. Any traces of Copper left after polish and clean
on top of the oxide, (Copper in trenches are surrounded by barrier film)
will contaminate the wafer at the next high temperature oxide deposition
step. I'm sure one has to also worry about the edge of the wafer and
having Copper come off due to "handling" in equipment.

I'm more worried that this process will have very poor yield and be
late at Dresden. Hope this helps.

Make It So,
Yousef
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  

HomeMailHotSubjectMarksPeopleMarksKeepersSettings
Terms Of UseContact UsCopyright/IP PolicyPrivacy PolicyAbout UsFAQAdvertise on SI
© 2025 Knight Sac Media.  Data provided by Twelve Data, Alpha Vantage, and CityFALCON News