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September 27, 5:15 pm Eastern Time
Company Press Release
SOURCE: Innovex, Inc.
Innovex Qualified for Chip Packaging Application at ASAT Ltd.; Production Ramp to Begin in 1st Quarter of Calendar Year 2000
HOPKINS, Minn., Sept. 27 /PRNewswire/ -- Innovex, Inc. (Nasdaq: INVX - news) reported that the company has achieved qualification status and a pre-production order for flex circuits used in a chip packaging application by ASAT Ltd., a leading semiconductor packaging company. ASAT Ltd. has qualified Innovex as a supplier for flex circuits used in their fine-pitch ball grid array (fxBGA) applications. Both companies anticipate a production ramp to begin in the March 2000 quarter.
''We are pleased to announce that we are now qualified by ASAT as a flexible circuit substrate supplier for this leading-edge chip packaging application,'' said William P. Murnane, Innovex, Inc. President and Chief Operating Officer. ''The market for chip packaging related flexible circuit substrates offers significant growth potential for our high technology flexible circuit operations and we are excited to be aligned with a technology leader like ASAT,'' he added.
''Innovex's technology roadmap aligns well with our current and future high density interconnect requirements,'' stated Richard Brancato, President of ASAT. ''Innovex will be offering a variety of materials and processes not presently available with the traditional flex tape suppliers. ASAT is delighted to qualify Innovex as a supplier of high density, advanced chip packaging materials,'' he added.
Typical applications for flexible circuit-based chip packages include hand-held and portable devices such as cell phones and pagers.
Innovex, Inc. is one of the world's leading suppliers of flexible circuit-based interconnect solutions to the computer, computer peripheral, communication, medical and other industries. Applications for flex-based interconnects include cellular telephones, hard disk drives, other storage systems, high-end consumer products, notebook computers, pagers and personal communication systems. Innovex is known worldwide for its excellence in advanced engineering and low cost manufacturing.
ASAT Ltd. Hong Kong is a worldwide leader of turnkey solutions in IC package design, assembly, and test featuring TBGA, fpBGA, LPCC, OptiPad and a wide variety of other plastic packages. ASAT maintains manufacturing facilities in China and France and other support facilities worldwide. ASAT Inc. is the distributor of ASAT Ltd.'s services in the United States. ASAT is located at 46335 Landing Parkway, Fremont, CA 94538. Website: asat.com
Except for historical information contained herein, the matters discussed in this release are forward looking statements that involve risks and uncertainties, including timely availability and acceptance of new products, the impact of competitive products and pricing, and other risks detailed from time to time in the companies' SEC reports, including Innovex, Inc.'s report 10K for the year ended September 30, 1998 and form 10Q for the quarter ended June 30th, 1999 and other Securities and Exchange Commission filings.
SOURCE: Innovex, Inc.
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