SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Politics : Formerly About Advanced Micro Devices

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Charles R who wrote (75839)10/18/1999 2:14:00 PM
From: Yousef  Read Replies (1) of 1571536
 
Chuckles,

Re: "My understanding is this is tight pitched metal that is used mostly
for cache and datapath to increase the routing density but not used for
global routing (I have heard it being counted like 1/2 layer metal)."

Well, there are two types of "local interconnect" (LI) ... One way is
to just enlarge the contact (between Metal 1 and Poly). This allows
a Poly to Source/Drain connection. The disadvantage is that now
there are two different contact sizes present at etch. The other
method is like a metal layer where a dielectric is deposited and patterned
followed by conductor deposition and polish/etch. This approach is
much more complicated, but allows the LI to cross over poly lines. The
LI metal is usually thin and narrow so resistance is high ... This is
why it is only used for "short runs".

Make It So,
Yousef
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext