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Politics : Formerly About Advanced Micro Devices
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To: Cirruslvr who wrote (77989)10/31/1999 1:42:00 AM
From: Dan3   of 1576256
 
Re: I bet Intel management is drooling at the cost savings...

Maybe they're just drooling :-)

Infineon seems reasonably happy with their 300mm FAB, but there is another side to the story:

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Yoon Woo Lee, president of Samsung Electronics, said that current step-and-scan technology has not increased its processing speed, and the time required for today's tools to process a single 300-mm wafer is long. "The throughput for 300-mm wafers is just 40 percent of what we are seeing in 200-mm wafers," he said. "So even though you can get much more bits on the bigger wafer, there is no real output benefit."

Complicating the equation even further, Lee noted that the
300-mm tools are more expensive than the equipment for 8-inch wafers, and materials costs are higher. The larger-diameter silicon disks are at least three times the price and demand more gases and other chemicals to process. "There are still many challenges before 300 mm becomes a reality in mass production," he said.
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The rest is at:
news.semiconductoronline.com{9C2CFF1E-8249-11D3-9A67-00A0C9C83AFB}

I think AMD will be just fine with 8 inch wafers for the next couple of years.

Cheers,

Dan
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