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Technology Stocks : C-Cube
CUBE 35.90+0.2%Dec 26 9:30 AM EST

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To: Maya who wrote (47259)11/2/1999 9:47:00 AM
From: BillyG  Read Replies (2) of 50808
 
(OT) ESS inks foundry pacts for needed wafer capacity next year

Semiconductor Business News
(11/02/99, 09:12:29 AM EDT)

FREMONT, Calif. -- ESS Technology Inc. here today announced a series of
agreements with unidentified foundries in the U.S. and Taiwan to secure enough
wafer-processing capacity for its projected needs through the end of the year
2000.

The fabless chip company said it reached those agreements with foundry partners
to guarantee it had access to advanced technology as wafer-processing capacity
grows tighter worldwide.

"Our foundry partners are among the most advanced in the world and offer ESS
access to the latest wafer technologies, including 0.18-micron and advanced
mixed-signal processes," said Robert Blair, president and CEO of ESS
Technology. "We will continue to use these advanced technologies to further
strengthen our product offerings in our core businesses -- digital video, Internet
appliances, broadband communications,and PC audio."

ESS Technology chairman Fred Chan emphasized that his company worked hard
in the past year to qualify multiple locations of foundry capacity in both the U.S.
and Taiwan. Some industry observers have noted that foundry customers are now
trying to limit their risk to future production problems following the Sept. 21
earthquake that temporarily closed all of Taiwan's fabs.
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