Texas Instruments and ARM to Collaborate on DSP and Microcontroller Platform For Next-Generation Wireless Information Applications
DALLAS, and CAMBRIDGE, England, Nov. 2 /PRNewswire/ -- Texas Instruments (NYSE: TXN) (TI) and ARM (Nasdaq: ARMHY) (LSE:ARM) today announced that the two companies will collaborate on a DSP and Microcontroller platform for next-generation wireless information devices such as smart phones, personal communicators and wireless Internet-enabled products.
The new Dual-Core platform, based on TI's industry-leading DSP technology and ARM's advanced 32-bit RISC microcontroller core, will be optimized to run current and future wireless cellular applications such as 2G+ and 3G. The platform, which will be compatible with existing TI and ARM(R) core-based solutions, will offer the increased performance and low power consumption required to run real-time audio and video applications on wireless information devices. Although the new platform will primarily be designed for cellular wireless devices, it will also provide broad appeal for other digital wireless applications such as short distance wireless and wireless LAN.
"This new agreement demonstrates TI's continuous commitment to the ARM architecture for the development of leading-edge wireless communications solutions based on TI DSP and ARM's next generation processor families," said Gilles Delfassy, vice president and director, Worldwide Wireless Communications Business Unit, Semiconductor Group, Texas Instruments.
In a separate agreement, TI has recently licensed the ARM10(TM) processor family to extend the performance and capabilities of its existing DSP and Microcontroller platform for 2G wireless applications.
TI and ARM have a long history of close collaboration in the wireless space, going back to 1993, including the licensing of cores from the ARM7(TM), ARM9(TM) and ARM10 families, and continuing with the future Dual-Core collaboration announced today. This relationship has enabled both companies to enjoy significant success in the wireless market.
"Collaboration with TI, the industry's leading DSP supplier, has led to several groundbreaking technologies driving innovation in the wireless market place. This collaboration is a prime example of the success of the ARM Partnership business model," said Mike Muller, executive vice president, Business Development, ARM. "TI's leading-edge DSP technology and ARM's advanced microcontroller architecture will enable OEMs to be on the leading- edge of next generation multimedia applications."
Texas Instruments has been a leader in the wireless communications space since the early 1980s, delivering world-class digital and analog components to leading OEMs.
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