Jim - <So are you saying that wafers, good die or packaged chips are going out the door? Maybe Intel has been stockpiling wafers?>
This is not true. As far as I know, what Otellini said was accurate, i.e., hundreds of thousands had shipped by the first week of launch, and on track for millions. We are being told there is a demand crunch, the exact same message Otellini said at the CC, with quantification provided in terms of % demand that was unanticipated.
I do not know why exactly there is not more visibility of the parts than there is.
The only data point I can provide, and it doesn't mean much, is this picture that was linked at The Register:
watch.impress.co.jp
This 733 was assembled two weeks before launch. The wafer came out of the fab a week or two before that.
All's I can go by is what the Execs are saying. At my end, I don't see any inconsistency with what they are saying. If something funny is going on, it's not happening at the manufacturing end. I'm not sure that there is anything funny going on, beyond what they are saying. That is a heavy demand situation, in which case OEM's would probably be getting virtually all the parts in the quantities produced to date outlined by Otellini. I'm also speculating that the i820 situation maybe playing a role in this, but I'm not sure on that one.
I do firmly believe that what I have said will be borne out in the end of Q analysis, as long as the parts are selling like Otellini is saying.
PB |
