Here come the 300mm fabs, all stocked with CYMI lasers.
November 10, 1999
Dow Jones Newswires
Taiwan Semicon Bd OKs Investment In 12-Inch Wafer Fab
TAIPEI -- Taiwan Semiconductor Manufacturing Co.'s (TSM) board of directors has approved total investment of NT$77.88 billion to expand capacity and build its first 12-inch wafer plant, the world's largest dedicated chip foundry said Thursday in a press release.
Of that total, some NT$58.95 billion will be channelled into expanding capacity and upgrading to 0.15-micron process technology at its Fab 5 and Fab 6 plants during 2000.
It will also expand its copper-based capacity at Fabs 3, 4 and 6 and will set up a bumping line in Fab 1 to meet future demand for FCIP (Flip Chip in Package), according to the release.
Meanwhile, TSMC will pump NT$18.61 billion into the construction of Fab 12, the company's first 12-inch wafer plant, and Fab 7.
Work on Fab 12, which will have a production capacity of 25,000 12-inch wafers per month, will begin during the first quarter of 2000.
Ground breaking for Fab 7 in the Tainan Science-based Park in southern Taiwan will begin in May or June, 2000. Fab 7, which will begin production at the end of 2001, will have a monthly capacity of 40,000 8-inch wafers made using 0.18, 0.15, 0.13 and 0.10-micron process technologies.
TSMC has plans to build another four plants in Tainan park.
The company's board also gave the go-ahead for investing US$10 million in Horizon Ventures Fund and approved Nov. 10 as the record date for coverting entitlement certificates for its 1997 Eurodollar Convertible Bonds into common shares. The conversion will boost TSMC's total paid-in capital to NT$76.7 billion.
- By Dermot Doherty;(8862)2502-2557; ddoherty@ap.org |
