The Smart Cut® process patents of Michel Bruel.
Bruel and Andre Auberton-Herve developed this technology at Le Léti (LETI), the French government laboratory. Dr. Bruel remains there, but he advises SOITEC, which was the first commercial spin-off from LETI in 1992. Dr. Auberton-Herve is now president of SOITEC.
U.S. #5,374,564 issued 12/20/94 to Bruel,
Process for the production of thin semiconductor material films
patents.ibm.com
U.S. #5,661,333 issued 08/26/97 to Bruel and Beatrice,
Substrate for integrated components comprising a thin film and an intermediate film
patents.ibm.com
See in particular column 5 on scanned image page 6/6 of this patent, starting with "FIGS. 3 to 5 render it easy to understand the stages for producing a substrate according to one characteristic of the invention."
U.S. #5,714,395 issued 02/03/98 to Bruel,
Process for the manufacture of thin films of semiconductor material
patents.ibm.com
U.S. #5,863,830 issued 01/26/99 to Bruel and Thierry,
Process for the production of a structure having a thin semiconductor film on a substrate
patents.ibm.com
Here's an interesting excerpt from the '830 patent:
DESCRIPTION
1. Technical Field
The present invention relates to a process for the production of a structure having a thin semiconductor film on a substrate having an expansion coefficient identical to or different from that of the film. The invention is particularly applicable in the microelectronics field and more specifically for producing structures with a thin, monocrystalline silicon film on a quartz or glass substrate. Such structures are e.g. used for the production of active matrix flat screens.
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Now, that's what I call proprietary technology! |
