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Technology Stocks : Kopin Corp. (KOPN)

KOPN 2.275

+2.9%

Nov 21 3:59 PM EST

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To: kinkblot who wrote (941)	11/14/1999 10:41:00 AM
From: kinkblot	Read Replies (2) of 1820

LETI Microtechnologies: Material and Electronic Technology: wafer bonding www-dta.cea.fr Check out the photo and description of a transparent Si substrate, bonded to quartz after circuit fabrication: In this example, the CMOS circuits were produced on a standard SOI wafer. Once the process was complete the wafer was bonded to a quartz wafer by molecular adhesion. The silicon substrate was then removed by rectification and selective chemical attack. The transparent quality of the resulting substrate is clearly visible in the non-metallized areas. The circuits are fully operational after the transfer. Amongst other things, there are applications for this type of circuit transfer in hyperfrequency circuits and miniature flat screens. How 'bout that! Hmmm... "amongst other things" ? Maybe they're not tellin' about the really good stuff. <g> NOTE: LETI is part of the CEA (Commissariat À l'Énergie Atomique); that's why the patents are assigned to them. WT

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