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Technology Stocks : Kopin Corp. (KOPN)

KOPN 2.275

+2.9%

Nov 21 9:30 AM EST

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To: kinkblot who wrote (948)	11/15/1999 8:41:00 AM
From: John Finley	Read Replies (1) of 1820

Good sleuthing! I know that I was always wondering how a large sheet of very delicate, extremely thin devices could be removed from the "host" wafer, transferred and aligned in a production environment. After reading about the Smart Cut technology I can see how it could be done. Very impressive! If KOPN doesn't use something similar I would be surprised. Of course I didn't imagine the Smart Cut process so it could be something equally as neat but distinct <g>. Y'know, if you were to transfer the "Smart Cut" layer to an SOS wafer you would have THREE devices surfaces on a transparent substrate. Hmmm.... I wonder how you'd go about interconnecting them. I suppose you'd have to use ITO or a similar transparent conductor. Connections are always a bugaboo. If you have a Casio quartz watch that has crapped out take it apart and look at how they connected the LCD module to the electronics. Totally impressive! Oh well, enough coffee for me! <g> JF

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