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Politics : Formerly About Applied Materials

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To: Gottfried who wrote (33238)	11/17/1999 8:34:00 PM
From: Proud_Infidel	Read Replies (2) of 70976

TSMC to Start Producing Microchips Using 300mm Wafers in Early 2002 November 17, 1999 (TOKYO) -- Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) of Taiwan said it will start mass-producing microchips using 300mm wafers in early 2002. The company recently announced that it has decided to invest a total of NT$77.561 billion in 2000, and it referred to its production lines using 300mm wafers. (NT$31.745 = US$1) According to the investment plan, NT$58.953 billion from the NT$75.561 billion investment scheme will be used for the following purposes. First, TSMC will invest in Fab 6 to enhance its production capacity and deploy a 0.15-micron design rule and copper wiring technology. Second, it will enhance the production capacity of Fab 5 and introduce a 0.15-micron design rule to the facilities. Third, it will expand the production capacities of Fab 3 and Fab 4, as well as introduction of a copper wiring technology. Fourth, TSMC will install a chip-interposer wiring line at Fab 1 to meet the increasing demand for a flip chip system for chip packaging. The remaining NT$18.608 billion will be invested in its new Fab 7 and Fab 12. Fab 7 will be a production line with 0.1-micron to 0.18-micron design rules to process 40,000 sheets of 200mm wafers a month. TSMC will start constructing the facilities in May or June 2000. Fab 12 will be a line to process 25,000 300mm wafers a month using 0.1-micron to 0.18-micron design rules. The company will start construction in March 2000 and mass production in early 2002. (Nikkei Microdevices)

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