FOR IMMEDIATE RELEASE
FOR FURTHER INFORMATION:
Julie Cline, Corporate Communications Program Manager
(408) 654-6464
Rick Walther, Logic Marketing Manager
(408) 492-8319
Sender: owner-mktbull-pr@idt.com
Precedence: bulk
IDT INTRODUCES INDUSTRY'S SMALLEST
DOUBLE-DENSITY(tm) LOGIC PACKAGE
New 48- and 56-pin TVSOP Reduces Board Space by
40 to 60 Percent
SANTA CLARA, Calif., April 16, 1997-Integrated Device
Technology, Inc. (IDT) (NASDAQ: IDTI), the world's
leading supplier of fast CMOS logic, today introduced the
industry's smallest Double-Density(tm) FCT and bus
switch packaging option.
The new thin very small outline packages (TVSOPs)
cut board space by 40 to 60 percent compared to previous-
generation shrink small outline packages (SSOPs). The
TVSOPs are rapidly gaining industry support in space-
constrained applications such as laptop computers and
PCMCIA-compliant devices that require high-performance
48- and 56-pin Double-Density 3.3- and 5-volt logic products.
"IDT's logic division continues its commitment to the
design and engineering community by providing the broadest
range of packaging options available for Double-Density high-
speed logic," said Rick Walther, IDT's logic marketing manager.
"With the introduction of the TVSOP, IDT is positioned to
support leading-edge applications and play a major role in
bringing the next-generation logic standards to market."
Advanced Package Miniaturization
Offered in 48- and 56-pin configurations, the TVSOP
features a maximum device height of 1.1 mm, representing a
significant advancement in packaging miniaturization. This
allows greater design flexibility and the ability to further
reduce the total amount of board space required. The TVSOP
occupies 62 percent less board space than a SSOP and 39
percent less board space than a thin shrink small outline
package (TSSOP). The device height meets the requirements
of PCMCIA applications, making the TVSOP an ideal solution
for personal digital assistants (PDAs) and notebook computers
where space is at a premium.
Ideal for Double-Density Bus Switch Applications
The TVSOPs can also be used with IDT's recently
introduced Double-Density FST bus switch devices. The 12-,
16-, 20- and 24-bit bus switches meet the need for fast, low-
power switching in the data communications and high-speed
personal computing markets. They are ideal for use in
conjunction with the TVSOP package in applications such as
voltage translation and hot/live insertion capability in
notebook computers. In networking and communications
products, IDT's TVSOP bus switches provide address and
data bus multiplexing without adding delay to critical bus
connections and exchanges.
Broad Range of Packaging Options
In addition to the TVSOP, IDT offers a wide variety of
packaging options including the SSOP and TSSOP for Double-
Density FCT and bus switch devices. The TSSOP, quarter size
outline package (QSOP), and small outline integrated circuit
(SOIC) are available for all octal functions.
IDT's Logic Leadership
IDT is the industry leader in high-performance, low-
power logic products, commanding 64 percent of the
worldwide FCT market. IDT's state-of-the-art technologies
allow the implementation of leading-edge logic functions in
today's high-performance systems and designs in the
communications, personal computing and data storage fields.
IDT offers a full spectrum of logic functions and packaging
options in a variety of families including 3.3- and 5-volt
bus interface devices available in octal and double-density
functions, clock management, bus switch and memory
support products.
Electronic Media Program
Information about IDT and its products is easily
accessible through IDT's comprehensive electronic media
program, which includes free CD-ROMs by calling
(800) 345-7015, a Home Page on the World Wide Web
(http://www.idt.com), and fax-on-demand services by
calling (800) 9-IDT-FAX. For more information about
these services, call (800) 345-7015.
About IDT
Integrated Device Technology, Inc. (IDT) designs,
manufactures and markets high-performance integrated circuits
and modules that are used in products in four rapidly growing
market segments: communications equipment, such as routers,
hubs, switches, cellular base stations and other devices;
distributed computing systems, such as workstations and
servers; personal computers (PCs), desktop and notebook;
and office automation equipment, such as laser printers and
color copiers. IDT enhances the opportunity of its customers
to optimize the cost and performance of their microprocessor-
based systems by providing innovative solutions based on
four product areas: high-speed SRAMs and Fusion
Memory(tm); communications products, including industry-
leading FIFO memories, multi-port memories and
Asynchronous Transfer Mode (ATM) products; RISC
microprocessors, optimized for both embedded as well as
reprogrammable applications; and high-performance logic.
Headquartered in Santa Clara, Calif., IDT employs
approximately 4,200 people worldwide.
***
Double-Density and Fusion Memory are trademarks of
Integrated Device Technology, Inc. |
