Tuesday November 30, 6:01 pm Eastern Time Company Press Release Ultratech Secures Multi-Million-Dollar Order From a Major Semiconductor Manufacturer
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Multiple Model 1500MVS systems to be used to produce power ICs and other ASIC devices SAN JOSE, Calif.--(BUSINESS WIRE)--Nov. 30, 1999-- Ultratech Stepper, Inc. (Nasdaq NM: UTEK - news), a leading supplier of photolithography systems used to manufacture semiconductors, micromachined devices and thin film heads (TFH) for disk drives, today announced a multi-million-dollar order for several Ultratech Model 1500MVS systems from a major semiconductor manufacturer. The order -- the result of a competitive bid with a prominent Japanese and a U.S. lithography supplier -- marks Ultratech's first installation at one of the customer's European facilities. The systems, which will replace the customer's existing contact printers, are slated for delivery in the first and fourth quarters of 2000 and will be used to produce power integrated circuits (ICs) and other application specific integrated circuit (ASIC) devices.
``This is a significant order for Ultratech Stepper,' said President and Chief Operating Officer, Dan Berry. ``Although our systems are represented at this customer's fabs in the U.S., Singapore and Europe, these new tools are destined for a site that was previously served by a major Japanese lithography supplier. While cost-of-ownership (CoO) was a significant factor in the customer's decision, of equal importance was product reliability and the availability of comprehensive service to support the machines in their new location. Ultratech's ability in these areas, recently validated by its receipt of the highest overall rating for lithography companies in both large and small supplier categories in the 1999 10 BEST Survey by VLSI Research Inc, made our company the supplier of choice for this large semiconductor manufacturer.'
A cost-effective and compact sub-micron stepper, Ultratech's Model 1500MVS delivers superior performance for chipmakers manufacturing low-cost ICs with design rules above 0.8 micron. Ideally suited for the manufacture of power ICs, linear and ASIC devices in existing fabs, the system's state-of-the-art Machine Vision System (MVS) pattern recognition alignment system provides a robust method for aligning to difficult product layers. The MVS minimizes the need for large scribe lines to support dedicated alignment targets, increasing die-per-wafer yields. Designed to reduce overall tooling costs, the Model 1500MVS' flexible, D-shape field maximizes wafer utilization and stepper throughput, while the tool's 1X reticle allows for multiple fields on one reticle. Combining reliability and yield with low reticle costs, the Ultratech Model 1500MVS provides optimum CoO advantages to manufacturers. As a production-proven tool, users benefit from a straightforward installation, quick production start up and low maintenance costs.
Visit Ultratech's Booth 3-A801 at SEMICON Japan to learn more about the Model 1500MVS and other exciting Ultratech products and technologies. |