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Technology Stocks : Jabil Circuit (JBL)

JBL 201.82

-5.7%

3:59 PM EST

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To: Nevin S. who wrote (5424)	12/6/1999 6:17:00 PM
From: seacruzer	Read Replies (1) of 6317

A BGA device is a silicon chip component where leads of the device are in a array of rows on the bottom of the device. The lead in this package is a solderball. Prior generation surface mount silicon packaging uses outer lead bonding (OLB), or a series of leads around the perimeter of the package. By using the bottom of the package for interconnection, BGA devices can achieve much higher density and shorter internal wiring for lower heat and power draw. Assembly is somewhat tricky and is considered an advanced manufacturing technology, especially on very closely spaced BGA devices. BGA devices are used extensively on small, power sensitive devices like notebooks and cellphones.

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