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Politics : Formerly About Advanced Micro Devices

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To: Mani1 who wrote (82289)	12/7/1999 10:41:00 PM
From: Bill Jackson	Read Replies (2) of 1576880

Mani, Thermal testing done for all after making them? I think they will test the current versus voltage at assorted speeds and use that to compare to a prior database of detailed tests. You would need to package them to run a full thermal test and at 50% yield half the packages would be wasted. They will get to know where on the die the good ones come from as well as the bad ones due to systematic errors and they will also find the random dirt errors. All this will be used to try to make a better yield of faster parts by slight line adjustments. They will have a sea of data to analyze and will know what parts are good before they package them. Packaging will introduce a few faults and so there will be final tests. If yu are making 20 million parts and you have 500 test jigs running 24/7 that is 12 minutes each for a test at flat out no rest. If the test take 1 second they can get by with 1 jig and have some down time. We need some input here to say what is the Intel/AMD test procedure and how long does it take at what stage in the process. Obviously the long slow tests will be put on the passing candidates...no sense wasting them on bad parts. Bill

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