Formerly About Advanced Micro Devices Message Board

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Politics : Formerly About Advanced Micro Devices

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To: Mani1 who wrote (82294)	12/7/1999 10:45:00 PM
From: Elmer	Read Replies (1) of 1576168

Re: "And you are also saying chip companies perform thermal analysis on every chip which it goes how the door?" The heat dissipation characteristics of the package material are known. The die area is known. The heat spreader characteristics are known. The test temperature is known. The voltage is known and the Icc(average) is known by measurement. Do the math. Sorry if you think I am condescending. I will try to tone down my response as you are asking intelligent questions. EP

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