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Politics : Formerly About Advanced Micro Devices

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To: Bill Jackson who wrote (82347)12/8/1999 2:03:00 PM
From: Elmer  Read Replies (1) of 1579120
 
Re: "Elmer, A DC spec, no clock dependence? "

Doesn't the term "Dynamic" suggest something to you?

Re: "I would expect them to test them with a short test like that on wafer and mark them all into a number of virtual bins. Of course some will be disposal stuff and some will need to be further tested. "

The spec would be selected largely to reduce fallout to a minimum. Probably ~0.1% representing actual process issues that would pose a reliability problem. Virtual bins may be used but the data would probably only be used for process monitoring or possibly adapting test limits to better screen outlying die that exceed a certain sigma that might better be determined on a fab lot by fab lot basis rather than a single bell curve for the generic process (tighter control). It is also possible to store wafer sort information on the die for reference at final test. There is a limit as to the detail I can provide.

Re: "It may be that the ones that take higher currents will end up as lower speed units "

Other way around Bill. The high current parts run faster, not slower, unless you mean intentionally limited to lower speed so as not to exceed the specs. Not likely.

Re: "). It makes sense to give a final test to the finished boards in the cartridge, but how extensive will that test be? a full load test at max speed will take a long time, so they must take some shortcuts as the time needed to exhaustively test parts may well become excessive?"

"exhustively" testing parts is not possible in a production environment nor would it significantly improve quality. A quality level above 99.9% can be achieved in a few seconds for most cases and the other cases get into an area that may invoke my NDA so I can't go there.

EP

If we are boring the thread perhaps we should take this offline.
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