Rambus Announces Technology and Market Directions
High Bandwidth Technologies to Address Communications Market
MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Dec. 9, 1999--Building on its successes in the computer and consumer markets, Rambus Inc. (Nasdaq:RMBS
- news), the leading supplier of high bandwidth chip connection technology, today released its technology roadmap for 2000 and announced an increased focus on
providing its technology to the communications market and for other chip-to-chip applications.
Rambus' technology roadmap for 2000 includes plans for a doubling of its already highest performance chip connection data transfer rate to 1.6 GHz. In addition,
the Company said it plans to develop technology for quadrupling the current Rambus memory module bandwidth to 6.4 GB/s.
According to CEO Geoff Tate, ``These advances in Rambus technology will further lengthen our lead in high bandwidth chip connections over competitive
approaches. Rambus will be able to provide system companies the performance improvements required as advanced applications are developed.'
With the growth of the Internet driving the need for cheap bandwidth, Rambus' memory interface technology is becoming a key enabler for cost-effective, high
performance communications products. Rambus has begun working with key communications systems and chip companies to enable the use of Rambus DRAM in
these applications, and expects first product announcements in 2000.
To date, the primary applications for the Rambus high bandwidth chip connection technology have been in the computer and consumer markets where products such
as the Sony PlayStation 2 and PCs and workstations from leading suppliers such as Dell, Compaq, HP and IBM are now going into production using Rambus
memory interface technology.
Rambus also announced that it has begun working with chip and systems companies to apply its high bandwidth chip connection technology to areas outside its initial
focus on the processor-to-memory bottleneck. There are many other chip-to-chip data transfer bottlenecks which hinder achievement of cost-effective, high
performance computer, consumer and communications systems.
The Company expects to disclose the first results of its efforts in this area in 2000.
To meet its focus on additional markets and applications for its technology, Rambus has expanded its organization. Dave Mooring, a nine-year Rambus employee
who most recently was Senior Vice President of the Computer and Memory Group, has been promoted to President with responsibility for day-to-day operations.
Within Mooring's organization are divisions supporting technology development and deployment for computer, consumer and communications markets. In addition,
Subodh Toprani, promoted to Senior Vice President, will lead a newly-formed new ventures group with responsibility for acquisitions and investments as required to
meet the Company's goals.
Both Mooring and Toprani will report to CEO Geoff Tate.
Rambus Inc. develops and licenses high bandwidth chip connection technologies to enhance the performance of computers, consumer electronics and
communications products. Providers of Rambus-based integrated circuits include the world's leading DRAM, ASIC and PC controller manufacturers. Currently,
eight of the world's top-10 semiconductor companies license Rambus technology.
More information on Rambus Inc. and its high bandwidth technologies is available at rambus.com.
This press release contains forward-looking statements, including statements concerning: Rambus' plans to double its chip connection data transfer rate to 1.6GHz;
plans to develop technology for quadrupling the current Rambus memory module bandwidth to 6.4GB/s; use of Rambus' memory interface technology as a key
enabler for cost-effective, high-performance communications products; and application of Rambus' high-bandwidth chip connection technology to areas outside of
the processor-to-memory bottleneck. Important factors may cause actual results to differ materially from those in the forward-looking statements. Among the factors
that could cause actual results to differ are: dependence upon commitment and success of third parties, such as communication chip and systems producers, in
developing and marketing components and systems incorporating Rambus technology; rapid technological changes in the markets addressed by Rambus, the
potential development of competing technologies; Rambus' ability to re-direct resources into new systems applications; and delays in development schedules.
Note to Editors: Rambus and RDRAM are registered trademarks of Rambus Inc. |
