Rambus Plans To Increase Module Bandwidth To 6.4 GB/s
12/09/1999
Dow Jones News Service
(Copyright (c) 1999, Dow Jones & Company, Inc.)
MOUNTAIN VIEW, Calif. -(Dow Jones)- Rambus Inc. (RMBS) plans to double its chip-connection data transfer rate to 1.6 gigahertz, as part of its technology "roadmap" for 2000.
In a press release Thursday, Rambus said it also plans to develop technology for quadrupling its Rambus memory module bandwidth to 6.4 gigabytes under the plan for next year.
Rambus , which makes technology for high-performance computer chips, said its high-bandwidth chip connection technology currently finds its primary application in the consumer and computer markets.
Additionally, the company said it began to collaborate with chip and systems companies to apply its high-bandwidth chip connection technology to areas outside of its initial focus on processor-to-memory bottlenecks.
Rambus expects to disclose first results from the collaborative efforts in 2000.
Also, with the growth of the Internet, Rambus said its interface technology will likely become important for cost-effective communications products.
As reported in Dec. 9 editions of The Wall Street Journal, Rambus expects makers of routers and switches for computer networks to start using its technology next year. By moving efforts into communications, Rambus might expand its market far beyond just computer and consumer-electronics markets. Royalties would be higher, since communications chips carry higher average prices.
-Leah McGrath; Dow Jones |
