Asian Semiconductor Mfg. to Expand Wafer Foundry Output
December 13, 1999 (TAIPEI) -- Asian Semiconductor Manufacturing Corp. disclosed that its second wafer plant will begin production next year, with monthly output of 10,000 units of 8-in. wafers.
The output of the company's first and second wafer plants is expected to reach 70,000 units a month by 2001.
Asian Semiconductor Mfg. executives said the company has been searching for a suitable site overseas for its third wafer plant, hoping to start operations, and further boost capacity by 2001.
Asian Semiconductor's output topped 16,000 wafers in November, exceeding its monthly target of 15,000 units, and the figure is expected to increase to 19,000 units soon.
Chang Ju-king, general manager of Asian Semiconductor, indicated that the capacity of the company's first wafer plant is likely to reach a ceiling of 30,000 units in June or July next year. Thus, it is eager to expand its output to meet growing demand.
To help meet this demand, Asian Semiconductor said it does not rule out the possibility of merging with overseas wafer foundry makers.
Chang said he has been approached by European and U.S. foundry makers about such opportunities. He said the company is studying the feasibility of mergers and acquisitions, and confirmed that the third wafer plant will adopt the 8-in. wafer standard.
Also, Asian Semiconductor has been rumored to be the target of Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) and United Microelectronics Corp. (UMC) for a merger and a strategic alliance, respectively.
Asian Semiconductor declined to comment on the rumors. Company executives said they are concentrating on keeping the company's operations on a steady track to solid growth.
(Commercial Times, Taiwan)
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