Formerly About Advanced Micro Devices Message Board

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Politics : Formerly About Advanced Micro Devices

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To: Bilow who wrote (83246)	12/16/1999 1:53:00 PM
From: Tenchusatsu	Read Replies (1) of 1571157

Carl, <But the really important thing about pins is that the new bump technology eliminates the need to bond each pad individually. It is quite obvious that this improvement in automation is going to drop the cost of pins to a very small fraction of the current cost.> Only to have that cost jump back up again thanks to high pin-count technologies like DDR SDRAM? But I see your point anyway, and it is well-taken. You need only to point to the increase in pin-counts from one processor generation to the next (486, Pentium, P6). But the bandwidth-per-pin advantages of RDRAM is hard to ignore when you want to integrate the memory controller onto the processor die. And it's also remarkable to me that the two examples I constantly bring up, Timna and Alpha EV7, are on two extreme ends of the scale (Timna in high-volume sub-$500 systems, Alpha EV7 in low-volume super-$100K systems). Anyway, I have another question: Isn't that "new bump technology" already being used? I'm not really up on package technologies. I do know that the components of Intel's 800-series chipsets are ball-grid arrays (BGA). Wouldn't that qualify as bump technology? Tenchusatsu

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