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Politics : Formerly About Advanced Micro Devices
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To: Charles R who wrote (83785)12/21/1999 1:52:00 AM
From: Mani1  Read Replies (1) of 1572847
 
Charles Re <<How much power do you think the chip could burn with enhanced thermal measures. 80W? 100W?>>

I have read papers pages long trying to answer this very question. It depends on many factors such as die size, package and the whole case design to name the few.

Assuming die size of around 100 mm, and Flip chip design, and no constraint from the case sizing, my guess would be around 120 Watts using forced air convection. The cost would be around $50.00.

Merced's large die size is actually a substantial advantage for thermal management guys. But considering that at 600 MHz it takes 250 Watts, the level 3 thermal management (from the case to ambient) is a large challenge. Level one and level two (die to the sink, sink to air inside) are also right at the limit of being forced to use liquid coolant. Currently thermal management is really bothering the Merced project.

Mani
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