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Politics : Formerly About Advanced Micro Devices

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To: Mani1 who wrote (83793)	12/21/1999 1:01:00 PM
From: Charles R	Read Replies (1) of 1572729

Mani, <Assuming die size of around 100 mm, and Flip chip design, and no constraint from the case sizing, my guess would be around 120 Watts using forced air convection. The cost would be around $50.00.> I expect thunderbird to be somewhere in the 130mm2 region, so I guess that would give it a little bit more leeway. I like your numbers. <Merced's large die size is actually a substantial advantage for thermal management guys. But considering that at 600 MHz it takes 250 Watts, the level 3 thermal management (from the case to ambient) is a large challenge. Level one and level two (die to the sink, sink to air inside) are also right at the limit of being forced to use liquid coolant. Currently thermal management is really bothering the Merced project.> That's one of the reasons I expect Merced to be launched on Intel's 0.13. Wilamette story should be somewhat similar. Given the recent good rumors about Dreden, AMD's window of opportunity may extend at least until Intel's 0.13 fully ramps up. The Wilamette vs Mustang battle is quite some ways away but I am starting to feel cautiously optimistic about AMD beyond Y2K. Chuck

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