SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Non-Tech : Ingram Micro
IM 38.890.0%Dec 13 4:00 PM EST

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Jack Hartmann who wrote (430)12/28/1999 5:45:00 PM
From: flickerful  Read Replies (1) of 576
 
Interlink Electronics to Ship New Versions of the ePad Electronic Signature Solution to Ingram Micro

CAMARILLO, Calif., Dec 28, 1999 (BUSINESS WIRE) -- Interlink
Electronics Inc. (Nasdaq: LINK) today announced shipments of its
ePad(TM) electronic signature solution to Ingram Micro.

This month, Interlink shipped initial stocking orders for both the ePad VP9002 (a turnkey signature approval solution that includes Silanis ApproveIt(TM) software for users of MS(R) Office(R)) and the ePad V9124 24-unit bulk pack. A third Ingram order, scheduled to ship in January, includes the ePad VP9001 (a signature binding solution that uses CIC's SignIt(TM) Software to bind signatures into Adobe 4.0 Acrobat(R) documents).

"In addition to the first commercial shipments of ePad for proactive beta and pilot programs, we are aggressively building a strong ePad reseller channel," said Preston Clark, Market Manager, Electronic Transactions, Interlink Electronics.

"Recent Ingram Micro orders guarantee the ready availability of ePad,
in all its versions, to resellers, VARs and systems integrators.
Primary applications include signature approval of paperless MS Office documents on networks, and signature binding to Adobe Acrobat documents across corporate intranets and over the Internet."


About the ePad Signature Solution

Starting in January 2000, Interlink Electronics' ePad electronic
signature solution will be available from Ingram Micro in three
distinct versions.

The first, ePad with Silanis' ApproveIt software, provides electronic
signature approval for MS Word and Excel documents. The second, ePad
with CIC's SignIt software, binds electronic signatures into Adobe
Acrobat 4.0 documents for use over networks, intranets and the
Internet. The third, the ePad 24-unit bulk pack, is shipped without
end-user software and is designed to provide optimal utility and value
to value-added resellers and systems integrators.

All ePad versions utilize Interlink Electronics' patented VersaPad(R)
semiconductive input pad to ergonomically emulate the natural feel of
hand signing on paper. In addition to simply recording the electronic
signature, ePad's semiconductive input pad also reports the stylus
pressure and time-to-sign data required by more sophisticated
applications such as biometric signature verification.

About Interlink Electronics

Interlink Electronics is an international leader in the development
of intuitive interface technologies and solutions. Innovative products
include electronic signature solutions for network and e-commerce
applications; interactive remote controls for business communications
and home entertainment markets; and integrated computer pointing
devices.

OEM partners include Sony, IBM, Microsoft, NEC, Sharp, Toshiba, InFocus
Systems and Mitsubishi. The company maintains offices in Camarillo and
Tokyo, and is available online at www.interlinkelectronics.com or in
Japan at www.interlinkelec.co.jp.

From time to time, the companies may issue forward-looking statements
that involve a number of risks and uncertainties. The following are
among the factors that could cause actual results to differ materially
from the forward-looking statements: business conditions and growth in
the electronics industry and general economies, both domestic and
international; lower-than-expected customer orders; delays in receipt
of orders or cancellation of orders; competitive factors, including
increased competition, new product offerings by competitors and price
pressures; the availability of third-party parts and supplies at
reasonable prices; changes in product mix; significant quarterly
performance fluctuations due to the receipt of a significant portion of
customer orders and product shipments in the last month of each
quarter; and product shipment interruptions due to manufacturing
problems. The forward-looking statements contained in this document
regarding industry and revenue trends, new product acceptance and
future business activities should be considered in light of these
factors.

Note to Editors: All registrations and trademarks are the properties of
their respective owners.

Copyright (C) 1999 Business Wire. All rights reserved.

Distributed via COMTEX.


CONTACT: Interlink Electronics Inc., Camarillo
Keith M. Roberts, 805/484-8855, ext. 130
kroberts@interlinkelectronics.com
Michelle Lockard, 805/484-1356, ext. 114
mlockard@interlinkelectronics.com

WEB PAGE: businesswire.com

GEOGRAPHY: CALIFORNIA INTERNATIONAL ASIA PACIFIC

INDUSTRY CODE: HARDWARE
SOFTWARE

Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext