Dense-pac Microsystem's Receives $912,000 Follow-On Order From Northrop Grumman
Follow-On Order of $912,000 for Army Program to Run Through 2005
GARDEN GROVE, Calif.--(BUSINESS WIRE)--Jan. 5, 2000--Dense-Pac Microsystems Inc. (Nasdaq: DPAC), a leading edge provider of high density semiconductor packaging solutions, Wednesday announced that the company has received a purchase order from Northrop Grumman for a Flash version of its patented memory stack.
The order, valued at $912,000, with delivery scheduled over the next three months, represents the second significant contract award for a key multi-year Army Program scheduled to run through 2005.
"The Northrop Grumman order is a firm indication that our sales initiative to stimulate Dense-Pac's penetration of the industrial, defense, and aerospace industries is gaining momentum," stated Ted Bruce, President and Chief Executive Officer of Dense-Pac Microsystems.
"Dense-Pac's patented ceramic stacks have been well recognized for their reliability within the aerospace industry since 1990."
Dense-Pac Microsystems is a technology company that specializes in the design of proprietary and patented three-dimensional high-density packaging. The products allow the company's commercial, industrial, defense and aerospace customers to pack large amounts of memory into small spaces.
Its commercial products include applications such as network servers, computers storage devices and medical instrumentation. IDA can include airborne and space avionics and such diverse areas as space satellites and missiles and high performance servers. The Company web site is at www.dense-pac.com.
This news release includes forward-looking statements, including statements regarding the company's market, technology development, expansion and hiring plans, which are subject to change. The actual results may materially differ from those described in any forward-looking statement. Important factors that may cause actual results to differ are set forth in the company's periodic filing with the U.S. Securities and Exchange Commission including its Form 10-KSB for the year ended Feb. 28, 1999.
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Contact:
Dense-Pac Microsystems, Garden Grove
Yvonne Huff, 714/898-0007
E-mail: yvonneh@dense-pac.com
or
Wall Street Investor Relations Corp.
Joe Zappulla, 301/948-3430
E-mail: JoeZ@WallStreetIR.com |
