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Politics : Formerly About Advanced Micro Devices
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To: Saturn V who wrote (85879)1/7/2000 8:55:00 PM
From: Kenith Lee  Read Replies (2) of 1572813
 
The Intel designs had the option of either wire bond or flip chip packaging. So the high speed parts and some laptop products have used flip chips. The cheaper low speed parts have been wire bonded and used plastic packaging. During the course of last year Intel introduced the OLGA package, which is a low cost flip chip package which I believe costs $12 or less.

Wire bond requires bond pads to be in the perimeter of the die. This increases die size when the number pads are very high such as mircoprocessor. Flip chip allows pads to be anywhere, including the center of die. I failed to see how Celeron can be bonded by both methods without having the leads shorting each other.
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