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Politics : Formerly About Advanced Micro Devices

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To: Kenith Lee who wrote (85943)1/7/2000 10:03:00 PM
From: Bill Jackson  Read Replies (2) of 1572918
 
Kenith if the inner part of the die is flip chipped then the part of the die that projects beyond this can be wirebond? Just a speculation? That way they can use some perimeter contacts of the older style and also connect in the middle of the die, here and there.
If someone knows the true answer to this, please comment.

Bill
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