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Politics : Formerly About Advanced Micro Devices
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To: Kenith Lee who wrote (85943)1/7/2000 11:12:00 PM
From: Saturn V  Read Replies (1) of 1572911
 
Ref" Wire bond requires bond pads to be in the perimeter of the die. This increases die size when the number pads are very high such as mircoprocessor. Flip chip allows pads to be anywhere, including the center of die. I failed to see how Celeron can be bonded by both methods without having the leads shorting each other."

The Intel chips have two sets of bond pads. Flip Chip Pads are small and are anywhere on the chip.In addition there is a PAD RING on the periphery which contains the wire bond pads. Intel has an easy way of dropping the pad ring, so on certain wafer starts the pad ring is dropped, giving more chips per wafer.
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