SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : IDTI - an IC Play on Growth Markets
IDTI 48.990.0%Mar 29 5:00 PM EST

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Stu E. who wrote (10659)1/12/2000 7:27:00 AM
From: Jim Oravetz  Read Replies (2) of 11555
 
Consortium Has High-Speed SRAM Achitecture
By Semiconductor Business News
Jan 10, 2000 (1:37 PM)
URL: techweb.com
The first design of a quad data rate SRAM standard for high-performance communications has been completed, the QDR SRAM Consortium said Monday. The consortium -- which consists of Cypress Semiconductor, Integrated Device Technology, and Micron Technology -- was formed last summer to target the next generation of switches and routers that operate at data rates above 200 MHz. The first products will be capable of 333-MHz data rates.
Development of the QDR SRAM architecture included extensive input from networking industry leaders. The devices are designed to greatly increase memory bandwidth compared to existing SRAM solutions in applications such as switches and routers, and will typically be used for look-up tables, linked lists, and controller buffer memory.
The first QDR SRAMs, configured as 512K-by-18, are in production and customer samples are slated for the first quarter. Each chip maker designs and manufactures the devices with its own technology in its own fabs, and will deliver products according to its own internal development schedules. All said they expect to make specific product announcements soon.
The three companies also announced an extension of their collaboration on the QDR SRAM standard. In order to ensure multiple, compatible sources, the three companies have defined initial road maps and migration paths up to 128-Mbit density. The group has also standardized on the space-saving 13-by-15-mm FBGA package. The consortium said it plans to publish the device specification after silicon verification.

++
With regard to the doom and gloom article. The individual makes his predictions based on "proprietary methods" without one piece of evidence that anything he is saying is true. Give us a example where these methods have worked, in real life. I see cell phones and cable modems and xDSL and DSP ? ie anything communications ? leading the charge towards higher IC device usage.

Jim
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext