Dan,
re:".13/copper"
A little different spin on FAB 22
Doesn't appear Intel will try to swallow 300 and .13 at the same time.
semiconductoronline.com{69E3E51B-D411-11D3-8C18-009027DE0829}
Intel to Build First High Volume 300 mm Fab 1/26/00 Ending months of speculation, Intel Corporation announced it will
build its first high-volume production manufacturing facility for 300 mm wafers in Chandler, AZ. The company said it will invest $2.0 billion to build and equip the facility, contingent upon local governmental approval.
"Fab 22 will give us more manufacturing capacity in order to help us better address our customers' growing need for high performance microprocessors,"
said Mike Splinter, Intel senior vice president and general manager of the Technology and Manufacturing Group.
The fab will begin production using Intel's 0.13-micron process technology with copper metallization on 200 mm wafers in 2001 and transition into the production of 300 mm wafers, Splinter said. The new fab will be located on
the company's Ocotillo campus in Chandler, near Intel's existing Fab 12. It will have approximately 360,000 square feet, 133,000 of which will be cleanroom. Additional buildings adjacent to Fab 22 will include a four-story,
320,000 square foot manufacturing support building, a 123,000 square foot central utility building and several expansions to existing buildings and a warehouse.
In addition, the company said it is continuing to evaluate other sites for additional manufacturing capacity, including its site in New Mexico. |
