SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Politics : Formerly About Advanced Micro Devices

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Process Boy who wrote (91183)2/2/2000 8:57:00 PM
From: Dan3  Read Replies (2) of 1576635
 
Re: Willy is a big die. I have to refrain from actual figures...

Here (I think) is the current Intel mix:

PIII .25 123mm2
PIII .18 106mm2
Cel .25 154mm2

Lots of wafer space will become available as the PIII transition from .25 to .18 is completed. More wafer space becomes available as the Celeron moves to .18 and new FABs come on line, but the new FABs are still next year at the soonest (is that correct? I'm assuming Israel is on line now, and the next FAB will be AR or the ex Rockwell facility in CO - AR is a bit more than a year away and CO is aimed at flash, right?)

But if Willamette is substantially larger than PIII .18, I would guess it won't be a chip that Intel will want to produce in volume until .13 and CO online (late Q4 to Q1 '01?).

It should be interesting, since it looks like AMD's strategy in that time frame will be to put 2 die on the chip that competes with Willamette, and early indications are that the dual processor AMD chip won't be much larger than Willamette. Two totally different approaches, each will probably have its strengths and weaknesses. How will two fast 9-pipe chips compete with one faster 11-pipe chip? (I think Willamette is 11 pipe, but I'm not sure)

I guess we'll find out in about a year!

Dan
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext