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Politics : Formerly About Advanced Micro Devices
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To: Hans de Vries who wrote (91436)2/3/2000 10:59:00 PM
From: kash johal  Read Replies (2) of 1575781
 
Hans,

re:"timna die size:Since Timna has: 1) PIII processor core = ~100 mm2 2) 740 3D graphics core = ~125 mm2 (450 mm2 in 0.35!) 3) Chipset functionality = ... mm2 We can estimate the die size at ~250 mm2 in 0.18 which is huge. Is Intel going to use this for the cheapest systems?"

I think you are way off here.

The CPU core only has 128Kl2 cache not 256K I believe - so say 80mm2.

The graphics and chipset and memeory controller may get up to 50mm2 max IMHO.

In a low cost plastic BGA we are looking at a $40 cost.

They will likely sell tons at $70-80.

VIA will have a tough time methinks.

By the time they set up to compete with celeron and a socket 370 drop in Intel will essentially kill off the celeron by Q3.

regards,

Kash
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