I posted this reply to a fellow who asked me a question on the CPSX thread at Clearstation.com, where I have a public portfolio...CPSX (OTC BB .81 fully filing):
John.... How quickly CPSX will move will depend on a few factors. However, if and when a significant contract is announced with a large company in the area of telecommunications/electronics it will bring initial attention to CPSX. Then, when the more industrious of the newcomers take the time to dig deeper and come to understand the nature of the materials produced by CPSX:
'
Ceramics Process Systems Corporation (the `Company` or `CPS`)
serves the wireless communications, satellite communications, motor
controller and other microelectronic markets by developing,
manufacturing, and marketing advanced metal-matrix composite and ceramic
components to house, interconnect and thermally manage microelectronic
devices. The Company`s products are typically in the form of housings,
packages, lids, substrates, thermal planes, or heat sinks, and are used
in applications where thermal management and or weight are important
considerations.
and the PROPRIETARY way in which those materials are produced:
'The Company`s products are manufactured by proprietary processes the
Company has developed including the QuicksetTM Injection Molding Process
(`Quickset Process`) and the QuickCastTM Pressure Infiltration Process
(`QuickCast Process`)'.
some vibrations may begin to occur along their spinal column. This will not happen will most of those who look into this company but it only needs to happen with a few. Those vibrations I hope will be caused by adrenalin rushing into their systems<GG>.
Then you look at the markets that need this stuff:
MARKETS
The Company`s primary markets are original equipment manufacturers
in the wireless communications, satellite communications, and motor
controller markets.
Wireless Communications Market
The demand for wireless telecommunications services such as cellular
and Personal Communications Systems (`PCS`) has grown significantly during
the past decade, driven by reduced costs for wireless handsets, a more
favorable regulatory environment, increasing competition among service
providers and a greater availability of services and microwave spectrum.
In developing countries wireless telephone networks are being
installed as an alternative to installing or upgrading traditional
wireline networks. The growth in wireless communications has required,
and will continue to require, substantial investment by service providers
in infrastructure equipment such as basestations. The Company provides
components for housing, interconnecting and thermal management of
microelectronic devices to wireless communications infrastructure
equipment manufacturers.
Satellite Communications Market
Satellites provide several advantages over earth-based facilities
for many telecommunications applications. Satellites enable high-speed
communications service where there is no earth-based alternative
available which is often the case for military operations and for
communications services in developing countries. Another advantage is
that the cost to provide services via satellite does not increase with
the distance between sending and receiving stations. The cost of
providing services via satellite can be less than the cost of installing
copper or fiber optic networks.
Demand for satellite telecommunications services for both military
and commercial applications is increasing. Some satellite applications
have both military and commercial applications such as the Global
Positioning System. Commercial applications include satellite based
mobile telephone services, direct-to-home television services, and
direct-to-home internet services. Military and commercial entities have
announced plans to deploy over 1,000 satellites during the next decade. The
Company provides components for housing, interconnecting and thermal
management of microelectronic devices to satellite subsystem and satellite
manufacturers.
Motor Controller Market
The use of power modules to control electric motors of all sizes is
growing. This growth is the result of several factors including emerging
high-power applications which demand power controllers such as hybrid and
electric vehicles, and cost declines in power modules which increasingly
make variable speed drives cost effective. Power semiconductors are a very
significant portion of the cost of variable speed drives, and the cost of
the module housing and thermal management system are also significant;
declines in the costs of all these components is driving increased use of
variable speed drives.
For example, worldwide approximately 50 million AC induction motors
greater than one-half horsepower are installed every year. Today only a
small percentage of these motors use variable speed drives because of
costs; as costs decline industry observers predict increased use of
variable speed drives. The Company provides components for housing,
interconnecting and thermal management of microelectronic devices to motor
controller manufacturers.
Then you look at the products they make for these markets:
PRODUCTS
All markets described above have a common need for thermal
management of electronic devices to improve system performance and
reliability. A second element which many segments within these markets
have in common is the need for lightweight components, particularly for
applications which are air-borne, space-based, or transportation related.
Using its proprietary process technology, the Company produces metal-matrix
composites with superior thermal properties and which are very lightweight
to house and interconnect microelectronic devices. Each of
these products is produced to customers` blueprints to meet customers`
specific requirements. Typical form factors are housings, packages,
lids, substrates, thermal planes, and heat sinks.
The manufacture of microelectronic systems is comprised of three key
steps: (1) the integration of transistors into integrated circuits
(`ICs`), (2) the integration of ICs on boards or modules, and (3) the
integration of boards and modules into systems. The Company produces
products for the second and third steps described above - products used
to integrate ICs on boards, and used to integrate boards and modules into
systems.
As the complexity, speed, and density of electronic devices
continues to increase, the market increasingly demands housing and
interconnecting products which have a thermal coefficient of expansion
match to ICs, and which provide for the efficient removal of heat from
the system while providing the necessary mechanical and electrical
properties.
The metal-matrix composite aluminum silicon carbide (`Al-SiC`),
manufactured using the Company`s proprietary processes, is a material
system which meets all these requirements and which is finding acceptance
in the marketplace as a replacement for copper, copper-tungsten, copper-
moly, and graphite. In addition, the Company`s aluminum nitride (`AlN`)
ceramic components are used in applications where very high thermal
conductivity is required.
And then you put 2 and 2 together and come up with unique products and processes that will be in great demand in my own opinion as the telecomm and electronics sectors continue their world wide boom. And add to that an additional opinion that this company, once their story gets out there, is going to raise some eyebrows and cause some real excitement...again, just my opinion.
The stock price will then take its natural course.
gpg |
