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Technology Stocks : Cymer (CYMI)
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To: Gemini who wrote (24241)2/10/2000 8:53:00 AM
From: Short A. Few  Read Replies (1) of 25960
 
Gemini,

In short, aluminum resistance has been a limiting factor in scaling down the width of some metal layers to DUV (sub i-line) dimensions. Copper has roughly half the resistance in narrow conductors, and enables wider use of narrower lines which do require DUV.

At least, we could for sure say that copper improves the performance and value of products made with DUV lithography, to a lesser extent I think this would also be true of i-line. I just don't see fabs making the investment in copper without using DUV more broadly also.

In general though I would argue that all truly feasible developments which speed down scaling out of i-line turf fall in line with Cymer product positions. So I am long.

Best,
SAF
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