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Technology Stocks : General Lithography

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To: Qualified Opinion who wrote (1151)	2/11/2000 9:25:00 AM
From: Katherine Derbyshire	Read Replies (1) of 1305

>>The industry seems to be leaning towards EUV then X-RAY for next generation lithography.<< Do you have a source for this opinion? Everything I've heard suggests that EUV is expected to take us to the End of CMOS. The wavelength difference between EUV and X-ray is minimal, and proximity x-ray will only get harder, not easier, as devices shrink. >>Sematech is leaning towards EUV because of its higher throughput. Even though Scalpel has a lower mask cost, it probably will not be enough to offset a lower throughput. << The Scalpel vs. EUV tradeoff depends strongly on the particular fab and especially on the number of wafers per mask. The most recent public statements from Sematech suggest that both approaches have merit. semiconductoronline.com{570CD227-B4DC-11D3-9A7B-00A0C9C83AFB} Katherine

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