--------------------------------------------------------------------------------
ADDENDUM ? NEMI?s Lead-Free Assembly Project
The NEMI Lead-Free Assembly Project was formed in 1999 to help North American companies develop the capability to produce lead-free products by 2001, with an eye toward total lead elimination by 2004 (with timing of actual deployment left to the participating companies). Activities are focused on the following objectives:
to select an alloy to be used as a ?standardized? lead-free solder alternative
to demonstrate production-ready parts, materials and processes for lead-free printed wiring board (PWB) assemblies
to cooperate with component, board and equipment manufacturers to allow for the smooth transition to manufacturing processes requiring temperatures up to 260øC
to develop criteria for the industry to evaluate lead-free processes
to modify or develop appropriate JEDEC, IPC or other related standards for lead-free electronics manufacturing
Project work is organized into four sub-groups. The Solder/Alloy Selection sub-group made the alloy recommendation. The Solder Reliability group?s task is to identify holes in the lead-free data in the public domain and work with other organizations ? such as the High Density Packaging User?s Group (HDPUG) and the Integrated Electronics Engineering Center (IEEC) at Binghamton University ? to recommend tests and lend support where needed. The Components sub-group will rank cost-effective lead-free component/PWB terminations (based on compatibility with the recommended lead-free solder system), and work with component/PWB manufacturers (through ITRI) to facilitate manufacture of high temperature rated components and PWBs. This group will also work with JEDEC, IPC and other related standards bodies to adapt standards to reflect processing parameters associated with use of lead-free solder and high temperature rated components/PWBs, and provide components and PWBs to assess reliability. Finally, the Environmental Legislation group will monitor and report on legislative initiatives throughout the world.
Organization of the NEMI Lead-Free Assembly Project and definition of the group?s activities are based on the recommendations of an industry-wide task force comprised of the following organizations:
3Com Corporation
AIM Solder
Alpha Metals
Celestica International, Inc.
ChipPAC Incorporated
Compaq Computer Corporation
Connor Winfield Corporation
Cookson Electronics
CTS Corporation
Delphi Delco Electronics Systems
Eastman Kodak
Electronic Industries Alliance (EIA)
HADCO
Heraeus Cermalloy
IBM Corporation
IEEC, SUNY-Binghamton
Indium Corporation of America
Intel Corporation
Interconnection Technology Research Institute (ITRI)
IPC
Johnson Manufacturing Company
KEMET Electronics Corporation
Litton Kester Solder
Lucent Technologies
Metallic Resources Inc.
Motorola Inc.
Multicore Solder
National Center for Manufacturing Sciences (NCMS)
National Institute of Standards and Technology (NIST)
Newbridge Networks Corporation
Nortel Networks
Philips Components
Plexus Electronic Assembly Co.
Praxair, Inc.
Raytheon Systems Company
Rogers Corporation, Circuit Materials Division
Shipley Ronal
Solectron Corporation
Storage Technology Corporation
Texas Instruments
--------------------------------------------------------------------------------
Project information:
Ron Gedney
NEMI
703-834-2084
rgedney@nemi.org
Press information:
Cynthia Williams
Edelman/GTT
207-871-1260
cwilliams@mindspring.com |
