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Politics : Formerly About Advanced Micro Devices
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To: Dan3 who wrote (90385)2/23/2000 11:12:00 AM
From: Katherine Derbyshire  Read Replies (2) of 1572395
 
>>But the articles did mention that wafers that use
copper were more sensitive to pressure variations during polishing steps and that a difficulty in processing the wafers was from pits developing during
the polishing process as the copper wore away more quickly than other materials (such as aluminum) used previously. <<

Part of the problem is that metal polishing of any kind is a new process. Part of the problem is that aluminum forms a nifty passivating oxide during polishing, which helps to control the rate of material removal. Copper doesn't. Part of the problem is that copper polishing is very pattern-dependent--you might completely obliterate an isolated feature without reaching the desired thickness in dense features. And part of the problem is that copper is just a pain in the neck to polish. An alloy might be easier, but would also have higher resistance.

Katherine
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