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Politics : Formerly About Advanced Micro Devices

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To: tejek who wrote (94799)	2/23/2000 1:41:00 PM
From: Katherine Derbyshire	of 1579541

>>Katherine, are you suggesting that the polishing problems with copper can't be overcome?<< No. I'm saying that process engineers will have to balance the polishing parameters (pressure, slurry, rate, etc.) in order to achieve an optimal balance among throughput, uniformity, yield, device characteristics, etc. This is the same balancing act that occurs in all processing steps, but since copper and CMP are both new an established set of "right answers" doesn't yet exist. Katherine

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