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Politics : Formerly About Applied Materials

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To: Ian@SI who wrote (34466)	3/1/2000 3:26:00 PM
From: Proud_Infidel	of 70976

Infineon mum on ProMOS expansion, plans 300-mm fab of its own By Jack Robertson Semiconductor Business News (03/01/00, 01:46:39 PM EDT) WASHINGTON -- Germany's Infineon Technologies AG moved quickly today to explain that it is planning to build a 300-mm wafer production fab at an existing Infineon complex that is completely separate from its current joint venture with Mosel-Vitelic Inc. of Taiwan. On Wednesday, an official with Mosel-Vitelic said a planned expansion of the ProMOS DRAM joint-venture fab in Taiwan would essentially become Infineon's first 300-mm volume production fab (see Feb. 29 story ). A spokeswoman at Infineon in Munich declined to comment on the ProMOS 300-mm fab announcement by Mosel-Vitelic, but she said the German firm was looking for a partner -- not necessarily another chip maker -- for a 300-mm production fab at an existing Infineon site. She would not reveal the site's location. Infineon has brought its present 300-mm wafer pilot line, a joint venture with Motorola Inc. in Dresden, Germany, to the level of making 64-megabit-qualified SDRAMs for the commercial market. Mosel-Vitelic stated that ProMOS would be expanded by adding a new 300-mm facility, with construction to start shortly and initial preproduction slated for late 2001. Infineon is expected to receive about $480 million to $580 million as its part of an overall $5-to-$6 billion IPO to come out March 13, with the bulk of funds going to the parent, Siemens AG. Officials said that about half of the IPO money going to Infineon will be used for capital spending. In addition, Intel Corp. has made a $250 million investment in Infineon (see Feb. 21 story ). All this is expected to help underwrite the big cost of building a new 300-mm wafer fab.

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