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Novellus and GaSonics Announce Agreement to Develop Photoresist and Residue Removal Solutions for Copper Interconnect Structures
SAN JOSE, Calif.--(BUSINESS WIRE)--March 7, 2000--Novellus Systems Inc. (NASDAQ: NVLS) and GaSonics International Corp. (NASDAQ: GSNX) today announced a cooperative agreement to develop and demonstrate a complete integrated process solution for photoresist and residue removal on next-generation semiconductor devices. Novellus will install the GaSonics PEP Iridia DL(TM) system in its Copper Integration Center located at 4000 North First Street in San Jose, Calif. in June. This applications lab is one of the industry's leading facilities for running copper dual damascene processes, and is designed to help semiconductor manufacturers make a smooth transition to the production of copper-based integrated circuits (ICs).
"We are pleased to welcome GaSonics into the select group of companies that make up the Damascus(TM) Alliance," said Wilbert van den Hoek, Novellus executive vice president for Integration and Advanced Development. "Novellus has formed an open alliance of equipment makers, including Lam and SpeedFam-IPEC, each with a unique best-in-class technology designed to cost-effectively and efficiently resolve the manufacturing and integration challenges specific to copper interconnect technology. Our newest member, GaSonics, delivers the PEP Iridia System, which will be included in the suite of copper process tools and is designed to remove photoresist and residue from our low-k dielectric films. Quite simply, the Iridia helps ensure our CORAL(TM) low-k films are cleaned with zero damage."
GaSonics' most advanced Integrated Clean tool, the Iridia, is capable of performing both photoresist and residue removal in the same chamber. With dual plasma source technology and both high- and low-temperature capabilities, the Iridia removes photoresist and residue from low-k dielectric films, like CORAL, with minimal impact on film properties. The reducing chemistry capability of Iridia ensures the integrity of Novellus' CORAL layer is maintained. Introduced in June 1999, CORAL is quickly becoming a critical element in the fabrication of copper dual damascene structures down to the 0.10-micron level. The combination of copper interconnects and advanced low-k films are expected to enable production of ICs below the 0.10-micron node.
"As design rules shrink below 0.18 micron, and materials such as copper and low-k dielectrics are introduced, wafer cleaning is becoming increasingly critical and complex," said Graham Hills, GaSonics' chief technical officer. "Fabs are under increasing pressure to ramp up to volume production using new copper processes in a very short timeframe. GaSonics has anticipated the importance of cooperative development and has forged relationships with key customers and equipment suppliers. By partnering with Novellus, we are helping to speed the implementation of these new processes."
Introduced last June, the PEP Iridia--GaSonics' latest and most advanced Integrated Clean tool--is the only system in the industry featuring a flexible dual-source configuration, single-chamber high- and low-temperature processing capability and closed loop temperature control. Increasingly, chipmakers are turning to dry post-etch residue removal tools as they integrate copper into advanced chips to achieve faster processing speeds with greater reliability.
About GaSonics International
(NASDAQ: GSNX) is a leading global supplier of Integrated Clean solutions. GaSonics' photoresist and residue removal tools improve device performance and increase yield in semiconductor manufacturing. GaSonics' technology leadership also includes vertical high-pressure (VHP) thermal processing for ultra-thin gate oxides and low-pressure chemical vapor deposition (LPCVD) for liquid-crystal display (LCD) manufacturing. Headquartered in San Jose, Calif., GaSonics supports its installed base of more than 4,500 systems through a global sales and support network. Additional information about the Company is available on GaSonics' website, located at gasonics.com
Integrated Clean(TM) and the Performance Enhancement Platform (PEP) Iridia(TM) are licensed trademarks of GaSonics International. All other trademarks mentioned herein are the property of their respective owners. GaSonics cannot guarantee the accuracy of the contents of this document and disclaims liability for any errors, omissions or future changes.
About Novellus Systems
Novellus Systems Inc. manufactures, markets and services advanced systems for the deposition of thin films on semiconductor wafers. The company's products are designed for high-volume production of advanced, leading-edge semiconductor devices at the lowest possible cost. Headquartered in San Jose, Calif., with subsidiaries in the United Kingdom, France, Germany, The Netherlands, Spain, China, Japan, Korea, Singapore and Taiwan, Novellus is a publicly traded company on the Nasdaq stock exchange (Nasdaq: NVLS). Additional information about the company is available on Novellus' home page on the World Wide Web, located at novellus.com >>>
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