I'm not sure but I believe it time to get in just because
of the RMBS connection.Even though its kinda old news.
-------------------- :^)d.a
aehr.com
Mountain View, CA, July 12, 1999 - Aehr Test Systems is announcing today the availability of the new MTX-R, the Massively Parallel Test System optimized for production of the latest generation of high-performance memories. The new system provides memory device manufacturers with a cost-effective alternative to traditional high-cost, high-speed test systems, enabling decreased testing costs for memories such as Rambus© DRAMs (RDRAM©) and Double Data Rate (DDR) DRAMs.
"The MTX-R was designed specifically for production memory testing," said Rhea Posedel, president and chief executive officer of Aehr Test Systems. "Its massively parallel testing architecture allows it to test more than 10,000 Rambus DRAMs in one system, while maintaining the high test accuracy necessary for full functional testing."
"This integrated test solution works because the MTX-R extends the test during burn-in system's capability to include high-performance functional tests. Manufacturers can maintain the same number of process steps as the traditional burn-in followed by test method, while dramatically decreasing the number of high-speed testers required to fully test the devices," Posedel added.
Already put to the test by several leading memory manufacturers, test results using the MTX Massively Parallel Test Systems have proven to correlate well with the test results of high-speed testers. This allows manufacturers to offload up to 70% of the tests traditionally performed on high-speed testers and more cost-effectively test semiconductor memories. High-speed testers are then used only for the parametric tests and high-speed sorting that require their high performance.
The MTX-R's powerful pattern generator and flexible timing system allow manufacturers to use the system to test most memory devices currently in production, including Rambus (Direct RDRAM), DDR SDRAM, SDRAM, DRAM and SRAM. The MTX-R is designed to make full use of the built-in test modes of Rambus memories.
"By implementing the MTX-R into the memory device test process, we believe manufacturers can shave off millions of dollars in capital and upkeep expenses at production levels," Posedel said. "This can lead to significant reductions in the cost of memory production. Lower test costs are required to bring the overall manufacturing costs of Rambus devices down in order to facilitate mass-market acceptance."
DiePak© Carriers address test socketing for new packaging technologies
Rambus RDRAMs and other new memory technologies offer new
challenges for memory testing. Because RDRAMs are typically mounted onto memory modules as flip chip die or as chip scale packages (CSPs), conventional burn-in and test sockets cannot always be used.
Aehr Test meets the test socketing challenge head on with the previously introduced DiePak carriers. Rambus DRAMs can be placed into these carriers as flip chip die or CSPs during the testing process. The DiePak carriers will then protect the Rambus DRAMs and electrically interface them to the test and burn-in systems. When test and burn-in are completed, the Rambus DRAMs have the high reliability required to produce high-quality memory modules.
"The combination of the MTX-R and DiePak carriers offers a complete solution for cost-effective burn-in and massively parallel test of RDRAMs," Posedel said.
The MTX-R and DiePak carriers can be viewed in the Aehr Test Systems display at Semicon West, Booth 10727 McEnery Hall, in San Jose, CA from July 14-16, 1999.
About Aehr Test Systems
Aehr Test Systems, headquartered in Mountain View, Calif., has been a leading provider of systems for burning-in and testing DRAMs and other integrated circuits since 1977, and has shipped over 2,000 systems worldwide. Aehr Test has developed and introduced two new innovative product families, the MTX system and DiePak© carrier. The MTX is a massively parallel test system designed to reduce the cost of memory testing by performing both test and burn-in on thousands of devices simultaneously. The DiePak carrier is a reusable, temporary package that enables integrated circuit manufacturers to perform cost-effective final test and burn-in of bare die. |
